No-Clean, UV-Visible Formula
The paste leaves minimal residue that doesn’t require cleaning, and its UV-sensitive component helps verify placement under UV light—ideal for precision work.

RMA-559 Rosin-Based Composition
Provides excellent solder wetting and oxidation control without harming delicate components, suitable for lead-free and leaded soldering.

High Viscosity for Precise Application
Thick, stable consistency ensures accurate placement without spreading, especially useful in BGA/SMD repair and micro-soldering.

Low Smoke, Lead-Free Compatible
Produces very little smoke during soldering and is safe for use with lead-free processes, making it suitable for environmentally friendly applications.

Excellent Insulation and Conductivity Support
Promotes solid and clean solder joints with high surface insulation resistance, reducing chances of bridging or short circuits.

Syringe-Type Packaging with Applicator Tip
Comes in a convenient 10cc syringe with a fine tip for controlled application, minimizing mess and waste during usage.

Versatile Use
Perfect for BGA reballing, SMD soldering, PCB pad preparation, and fine-pitch component rework across consumer electronics, drones, and industrial boards.