Fully Integrated SiP Solution
Combines CPU, memory, RF circuitry, and passive components into one small package for simpler design and manufacturing.

Dual-Core Xtensa 32-bit LX6 Processor
Offers up to 240 MHz processing speed for handling complex tasks and real-time operations.

Integrated 4MB SPI Flash
Provides onboard non-volatile memory for firmware and application storage.

Wi-Fi 802.11 b/g/n Support
Enables wireless internet connectivity in the 2.4 GHz band with standard networking protocols.

Bluetooth v4.2 Dual Mode (BR/EDR and BLE)
Allows both classic and low energy Bluetooth connections for a wide range of applications.

Compact 7 × 7 mm QFN Package
Ideal for space-sensitive designs such as smart wearables and compact IoT nodes.

Low Power Consumption Modes
Features deep sleep and light sleep modes, enabling energy-efficient operation in battery-powered devices.

Rich Set of Peripherals
Includes UART, SPI, I2C, I2S, PWM, ADC, and touch sensors for diverse interfacing options.

Security Features
Hardware encryption, secure boot, and flash encryption help protect data and firmware integrity.

Wide Operating Temperature Range
Suitable for operation in industrial and consumer environments with robust thermal stability.