High-precision laser cutting
Laser-cut apertures with micron-level accuracy ensure precise and consistent solder paste application, critical for fine-pitch components like BGAs and QFNs.

Superior paste transfer efficiency
Optimized aperture shapes and smooth walls help release solder paste effectively, reducing defects such as insufficient solder or bridging.

Durable stainless steel construction
Made from high-grade stainless steel, stencils offer long-term durability, resistance to wear, and support for high-cycle use in production environments.

Customizable aperture design
Aperture size, shape, and layout can be tailored based on component needs and paste volume requirements, following standard stencil design guidelines.

Available in framed and frameless formats
Framed stencils are tensioned for use in semi-automatic and automatic printers, while frameless stencils are ideal for manual or prototype applications.

Tight tolerance control
Manufactured with strict dimensional accuracy to ensure perfect alignment between stencil openings and PCB pads during printing.

Consistent thickness options
Offered in standard thicknesses (e.g., 0.10mm, 0.12mm, 0.15mm), enabling precise control over paste volume to suit different component densities.

Smooth and polished aperture walls
Laser-cut and optionally electro-polished walls enhance paste release and reduce clogging, improving printing quality over extended use.

Support for complex PCB layouts
Ideal for dense or multilayer PCBs with mixed-size components, ensuring accurate paste placement even in high-density configurations.

Fiducial marks for easy alignment
Integrated fiducial markers help align the stencil with the PCB quickly and accurately, saving time and reducing the chance of misprints.

Reusable for small-batch production
Especially in prototype or low-volume runs, frameless stencils can be reused multiple times, offering a cost-effective SMT solution.